The bond line

The gap between the parts, and therefore the thickness of the adhesive film, has an important bearing on the characteristics of the joint. In terms of simple strength a thick bond line will generally be a weakening feature, since the mechanical strength of the unsupported resin film is likely to be less than that of the substrates.

A thick bond line can however confer advantages. The adhesive is generally more flexible than the adherents or substrates. This is particularly so in most engineering applications where metals or other rigid materials can be bonded. Because of this, a thick bond line can offer a capacity to absorb some impact energy, thus increasing the strength of the bond under this type of loading.

Consideration of bond line thickness leads immediately to the question of environmental resistance.

Adhesive bonds will always be susceptible to environmental attack and it is essential that any such attack should not reduce the strength of the bond to an unacceptable level. The most important factor here is the correct choice of adhesive, but design of the joint can make a significant difference. Thus a thick bond line offers a ready path for access by moisture or other solvents which might be able to diffuse through the cured adhesive.

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